在线等离子清洗机 In-line plasma cleaning machine
自动等离子体清洗机作为专业处理设备，专门为芯片制造工艺提供清洁和表面活化。它包括多个上/下料系统，使用户能够快速、方便地安装/卸载五个料盒并同时处理五组芯片。清洗开始后五组芯片将由夹具同时从料盒中取出，送入反应仓进行处理，清洗完成后夹具将芯片送回到其原来料盒的原来位置。自动等离子体清洗机主要应用在以下工艺过程中：
1 在引线焊接前的铜框架清洁。
2 邦定之前有机物的清洁。
3 提高成型前的附着力。
4 在半导体封装过程中去掉助焊剂。
5 芯片表面活化，清洁。
6 利用倒装芯片法进行封装之前的活化。
As the professional processing equipment, automatic plasma cleaning machine is specialized in providing the cleaning and surface excitation for the chip manufacturing process. It includes the loading/feeding system, which can make the users easily install / unload the five feeder bowls while treating five groups of chips. After conducting the cleaning, five groups of chips can be taken out from the feeder bowls with clamp then sent it into reaction bin for treatment. After the cleaning has been completed, the chip is sent back to the original location with clamp. The processes used in the automatic plasma cleaning machine can be shown as follows:
1. Keep the copper framework clean before carrying out the wiring
2. Conduct the cleaning before the binding the organic matters
3. Improve adhesive force before its forming
4. Remove the scaling powder during the installation of the semiconductor packaging
5 Conduct the surface excitation and cleaning.
6. Conduct the excitation before packaging with flip chip method.
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设备型号Type |
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反应仓材质(mm) Chamber material |
不锈钢 520*350*300 Stainless steel 520*350*300 |
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等离子体频率Plasma frequency |
13.56MHz |
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芯片料盒尺寸Chip feeding box size |
80*240*150 |
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可安装料盒数量 Feeding box number |
（1-5）盒 |
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射频电源功率Radio frequency power |
（0-1000）W可调 Adjustable |
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气体流量 Gas flow |
(0～200)ml/min（标准气压,0℃） |
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单次清洗芯片数量Chip number of each cleaning |
200片 200 pieces |
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动力配置Power |
380×(1±10%)V(AC) 50Hz～60Hz ≤6KW |
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外观尺寸(mm) Boundary dimension |
1750*700*1660 |
可根据客户要求订制 The machine can be made according to the customer’s requirements
